Xiaomi CEO Lei Jun has revealed Xiaomi’s own self-developed mobile SoC named XRING O1. XRING O1 is built on the latest technologies available, making it the strongest chip from a Chinese brand, and marks its growing reliance on its own technology. The XRING O1 is scheduled to launch in late May 2025. The XRING O1 is more than just another processor; it is the culmination of a decade-long research and development journey that Xiaomi has undertaken to become a significant player in the semiconductor industry.
Built on TSMC’s 3nm Process:
What sets the XRING O1 apart is how it is made. The XRING O1 is made using the most advanced manufacturing process in the world, TSMC’s 3nm node, making it the first Chinese chip to hit this benchmark. This node makes it possible to achieve more efficient use of energy, faster processing, and better control over heat than previously seen. This decision by Xiaomi makes its chips more advanced than those of their competitors in China and allows them to take on Apple’s A-series, Mediatek Dimensity series, and Qualcomm’s Snapdragon in the international market.
Lei Jun’s announcement positions Xiaomi not just as a smartphone brand but as a vertically integrated technology powerhouse. By developing its chip, Xiaomi joins an elite group of global tech giants with in-house silicon, such as Apple, Huawei, and Samsung. More importantly, it marks a critical step for China in its pursuit of semiconductor independence amid increasing geopolitical and trade tensions.
This breakthrough chip will be introduced in the upcoming Xiaomi’s latest flagship phone, the Xiaomi 15S Pro.
Launch Timeline
Xiaomi 15S Pro and Xiaomi XRING O1 processor are to be released at the end of this month in China. The smartphone will be exclusive to the Chinese market only, with no global launch planned. So, fans who want to buy the 15S Pro will have to import it to their regions.
