Qualcomm is gearing up for the highly anticipated official unveiling of the Snapdragon 8 Gen 3 chipset. Following this release, several leading brands, including iQOO and Xiaomi, are poised to introduce their latest flagship smartphones featuring this potent chipset. Anticipation for the upcoming Snapdragon chipset is running high, and the competition with MediaTek, which is preparing to launch its flagship Dimensity 9300 SoC in the near future, promises to be fierce.
Qualcomm Snapdragon 8 Gen 3 is launching on October 25th, 26th in China
Qualcomm on the Chinese microblogging platform Weibo posted the warm-up teaser of the upcoming Snapdragon 8 Gen 3 chipset. The poster confirms that Qualcomm is heading its annual mobile summit in China on October 25th and 26th. The forthcoming SoC would be unveiled in the same event. Not only this, the poster also gives us a hint that the launch is going to be highly AI-focused.
The post reads “As the world enters the AI era, Snapdragon brings AI closer to you. Snapdragon’s artificial intelligence accelerates the arrival of heart-touching mobile experiences, from mobile phones to PCs to audio, subverting your senses in all aspects. With Snapdragon, AI is within your reach.”
This single teaser is enough for us to conclude that the upcoming Snapdragon chipset will be focused on the AI counterpart. And even the launch itself is expected to be based on the theme of Artificial Intelligence.
Read more; MediaTek Dimensity 9300 might outperform Snapdragon 8 Gen 3 in performance
Coming down to the hardware configuration, the Qualcomm Snapdragon 8 Gen 3 will use 4 power-saving cores and 4 performance-oriented cores. The performance cores will have the config of 1X primary core and 3X secondary cores. The primary performance core will have the clock speed of 3.19 GHz and most probably, this is going to be the ARM Cortex X4. Further, the chipset would be based on TSMC’s latest 4nm fabrication process which gives us an assurance that it will most probably not have any major heating issues.
[Via]