Xiaomi is all set to launch its new Xiaomi 15S Pro device in China on May 22nd. It would be the first smartphone to be powered by the firm’s in-house designed and developed XRING 01 chipset. The early benchmark reports of that chipset reveals impressive performance. It’s on-par, if not better than the Snapdragon 8 Gen 3 SoC which is commendable. Now, the first official image revealing the design of the upcoming gadget has been released.
Xiaomi 15S Pro official design revealed
The President of Xiaomi mobile’s Chinese division, Lu Weibing, has revealed the design of the Xiaomi 15S Pro smartphone in an official video. The design looks very similar compared to the Xiaomi 15 series. However, the rear panel seem to have a carbon fibre kevlar finish texture. The camera decor is in square shape with four individual circular cutout for the camera lenses.
The camera deco has a glossy finish with LEICA branding in the centre. It has three different lenses. The cutout for the LED light is separate from the camera deco. There is a pill-shaped cutout right next to the deco, which houses the LED light along with the branding of XRING, the company’s own chipset that powers the device.
ITHome, a Chinese publication, has also shared an image of white colour variant of the Xiaomi 15S Pro. The device seems to have a plain matte finish on the rear, unlike the Black variant which has carbon fibre finish. The device was recently spotted on the Geekbench with the model number Xiaomi 25042PN24C and had the single core score of 2709 and multi core score of 8125. For reference, the scores are better than the Qualcomm’s last year flagship chipset, the Snapdragon 8 Gen 3.
